Electrical Simulation of materials and semiconductor devices in 2D and 3D. Extraction of their operating characteristics such as current-voltage (I-V), capacitance (C-V, C-f), reliability, hot carriers.Instrumentation•TCADsimulationsoftwarefor2Dand3Dmicroandnanodevices(Silvacosuite: Devedit,Athena,Atlas,andSynopsys:Sentaurus),withcompatibilityofsimulated devices to SPICE software.•Highperformancecomputationalsystem(computernetworkandsoftwareinLinux and MS Windows) for TCAD calculations.Publications1.T.A.Oproglidis,et.al.,AnalyticalDrainCurrentCompactModelintheDepletion OperationRegionofShort-ChannelTriple-GateJunctionlessTransistors,IEEE Transactions on Electron Devices 64, 66 (2017).2.D.H.Tassis,et.al.,Source/drainoptimizationofunderlappedlightlydoped nanoscale double-gate MOSFETs, Microelectronic Engineering 87, 2353 (2010).3.N.Fasarakis,et.al.,CompactCapacitanceModelofUndopedorLightlyDoped Ultra-ScaledTriple-GateFinFETs,IEEETransactionsonElectronDevices59,3306 (2012).4.C.A.DimitriadisandD.H.Tassis,Onthethresholdvoltageandchannelconductance of polycrystalline silicon thin-film transistors J. Appl. Phys. 79, 4431 (1996).5.D.H. Tassis,et.al.,Lowfrequencynoiseinβ-FeSi2/n-Siheterojunctions, Appl.Phys. Lett. 72, 713, (1998).